Xring O3 processor demonstrated high efficiency

Xiaomi has unveiled its new flagship processor, the Xring O3, according to One.uz.

In initial independent tests, it demonstrated high performance. The data is based on information from ixbt.com.

Specialists from Xiaobai’s Tech Reviews tested the processor on a dedicated reference device. The results were evaluated at the level of leading chipsets.

The single-core Geekbench score for the Xring O3 processor is 3854 points. This indicates approximately a 25% performance improvement over its predecessor, the Xring O1 model.

In the multi-core test, the result was particularly strong. The Xring O3 with a 10-core configuration scored 15,086 points.

This figure exceeds the 12,000-point mark of current devices based on the Snapdragon 8 Elite Gen 5. In terms of manufacturing process, the Xring O3 is being developed using TSMC’s 3-nanometer N3P technology.

This distinguishes it from the upcoming 2-nanometer solutions from Qualcomm, Apple, and MediaTek. As a result, the multi-core performance of the Xring O3 is estimated to be about 55% higher than that of the Xring O1.

Graphics capabilities also improved by 40% in the 3DMark Steel Nomad Light test, and by over 90% compared to the previous generation.

Energy efficiency has also improved, with Xiaomi engineers reporting significant gains in this area.

If these results are maintained in mass-produced devices, Xiaomi will possess a highly competitive and powerful processor. The Xring O3 chip is planned for use in the upcoming Xiaomi 18 Fold and Pad 9 Pro Max devices.

This news is regarded as an important step in the development of Xiaomi’s technologies.